Aerogel Insulation Blanket for Compact High-Temperature Heat Sources
SINOYQX Aerogel–Melamine Micro-Insulation Series
As modern batteries, energy storage systems (ESS), inverters, SiC/IGBT power modules, and fast-charging electronics become smaller and more powerful, heat is increasingly concentrated in tighter spaces. Conventional insulation often faces three common bottlenecks:
- No room for thickness — the insulation layer must be ultra-thin.
- Not enough temperature separation — thin materials often can’t block high heat flux effectively.
- Higher safety requirements — flame resistance and durability are now mandatory.
SINOYQX Aerogel–Melamine Micro-Insulation Series is built to solve these challenges. It delivers ultra-thin (1–4 mm) thermal barrier performance, scalable converting, and laminate compatibility—helping engineers keep heat where it belongs and protect sensitive components in micro-space designs.

1) Positioning: Focused on the Global “Compact High-Temperature Heat Source Insulation” Market
SINOYQX targets the most demanding and fastest-growing thermal management scenarios:
- Micro-space constraints: cell-to-cell gaps, module cavities, enclosure interiors, and tight assemblies
- High heat flux density: rapid temperature rise and short heat spreading paths
- Safety-first design: flame retardancy, thermal stability, and testable performance
This platform supports multiple industries including batteries/ESS, power electronics, consumer electronics, and industrial equipment.
2) Value Proposition (Core Claims)
✅ Ultra-thin 1–4 mm structures: meaningful temperature separation in limited space
With proper stack-up and boundary conditions, designs can achieve 20–50°C temperature difference (dependent on heat source power, contact resistance, and cooling boundaries).
✅ Thermal conductivity as low as 0.012 W/m·K: thin, yet highly effective
This series can reach thermal conductivity as low as 0.012 W/m·K (subject to thickness, density, temperature, test method, and laminate configuration).
This enables higher thermal resistance per millimeter—allowing you to stay thin while improving thermal separation.
✅ Inherently flame-retardant pathway: UL94 V-0
For battery and power electronics, fire safety is a hard requirement. This series supports UL94 V-0 grade design and validation (subject to third-party test reports).
✅ Wide operating temperature window: -200°C to +240°C
Suitable for thermal cycling, long-term service, and harsh environments across a wide temperature range.
✅ Converter-friendly: die-cutting, bonding, and lamination (PET/PI/aluminum foil)
Engineered for engineering adoption and mass production:
- Die-cut / kiss-cut converting
- Bonding / PSA backing
- Lamination stack-ups with PET / PI / aluminum foil and other functional layers
✅ Optimized for micro-space, small volume, and high heat flux
Designed for thermal barriers, hot-spot shielding, thermal-runaway mitigation structures, and sensitive-component protection.
3) Typical Specifications (For Website Display)
Note: Values vary by grade, thickness, density, laminate stack-up, and test conditions. Final specifications should be confirmed by test reports.
| Item | Typical Capability |
| Thickness range | 1–4 mm (customizable) |
| Thermal conductivity | as low as 0.012 W/m·K (condition dependent) |
| Flame retardancy | Supports UL94 V-0 pathway (per test reports) |
| Operating temperature | -200°C to +240°C |
| Converting | Die-cutting, bonding/PSA, lamination |
| Lamination options | PET / PI / aluminum foil (custom stack-ups) |
| Target scenarios | Micro-space, high heat flux, compact hot sources |
4) Battery & ESS: Turning Thermal Safety Into Structure
In battery systems, insulation is not only about blocking heat—it’s about increasing system safety margin and improving containment design.
Typical integration points include:
- Cell-to-cell thermal barriers to delay heat transfer
- Hot-spot shielding for wiring, plastics, sensors, and enclosures
- BMS/PCS thermal isolation to reduce drift and stress from nearby heat sources
- Thermal-runaway mitigation stack-ups using aluminum foil / PI laminates for multi-layer protection
The result is an engineered, scalable “thermal barrier structure”—not just thicker insulation.
5) Power Electronics: Stabilizing the Boundary Around SiC/IGBT Heat Sources
Power modules often suffer from concentrated heat near temperature-sensitive components and tight packaging.
Applications include:
- IGBT/SiC module peripheral insulation
- Inverter / DC-DC cavity lining to reduce heat spreading into enclosures
- Protective stack-ups combining insulation + electrical insulation (PI) + thermal reflection (foil)
6) Consumer Electronics & Industrial Equipment: When Space Is the Biggest Constraint
For fast-charging, compact modules, and local hot zones inside small cavities, the key is often fit + manufacturability as much as thermal performance.
SINOYQX focuses on making insulation thin enough to integrate, and convertible enough to mass produce.
7) Engineering Adoption: A Simple 3-Step Approach
Step 1 — Define your heat source and boundaries
Power, contact interface, airflow/heat sinking determine achievable temperature separation.
Step 2 — Select stack-up and assembly method
- Insulation only: single ultra-thin layer
- Insulation + reflection: add aluminum foil
- Insulation + electrical isolation: add PI
- Faster assembly: PSA backing / positioning features
Step 3 — Lock specs with test methods
Fix the test standard, load/pressure, temperature points, and interface materials—then validate via internal or third-party reports.
8) FAQ
Q1: Under what conditions is 0.012 W/m·K measured?
A: Thermal conductivity depends on standard, temperature, thickness/density, compression, and laminate stack-up. For program adoption, define the test method and conditions and confirm by reports.
Q2: Can 1–4 mm really achieve 20–50°C temperature difference?
A: Yes—when total thermal resistance and interface/contact resistance are engineered properly. Actual results depend on stack-up and boundary conditions and should be validated with prototypes.
Q3: Can it be shaped and assembled efficiently?
A: Yes. The series supports converting (die-cutting), bonding/PSA, and lamination with PET/PI/aluminum foil for mass production.
Contact SINOYQX
If you are designing insulation for batteries, ESS, inverters, or any compact high-temperature heat source, SINOYQX can support samples, stack-up recommendations, benchmarking tests, and production adoption.
SINOYQX
- Email: [email protected]
- Phone/WeChat: +86-13540702776
- Website: www.sinoyqx.com